Abstract: The novel lumped-parameter thermal models (LPTMs) have been developed for a general cuboidal component in Part I. In this article (Part II), the proposed thermal modeling method is developed ...
Tested with Maya 2023, 2025. v0.2.0 This project enables AI assistant clients like Claude Desktop to control Autodesk Maya through natural language using the Model Context Protocol (MCP). This is ...
ASM GaN: Industry Standard Model for GaN RF and Power Devices—Part-II: Modeling of Charge Trapping
Abstract: Because of charge trapping in GaN HEMTs, dc characteristics of these devices are not representative of high-frequency operation. The advanced spice model GaN model presented in Part I of ...
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