Two-dimensional (2D) materials, thin crystalline substances only a few atoms thick, have numerous advantageous properties ...

TSMC is working to ensure that its plants don't use equipment from Chinese businesses in its N2 fabs. The impetus for this ...

The technique is advantageous, as it can be used to mass produce considerable numbers of chips on a single wafer, and with minimal interaction with the on-wafer chips during the entire process.

Macworld Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the ...

For the first time, Denmark is establishing production of microchip wafers at the leading standard. This makes Denmark a ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...

TSMC has already made a system-on-wafer for Tesla's Dojo supercomputer, but this version does not offer the kind of 3D-stacking with logic and memory the company has in mind for the next version ...

The Company owns and operates a 120,000 sq. ft. ISO-9001:2015 registered commercial wafer-manufacturing facility located in Canandaigua, NY, which includes a class 100 / class 1000 cleanroom ...

In wafer-to-wafer, you have already processed the first wafer (A). Then, a second wafer (B) with dies undergoes the same process (damascene, CMP, metrology). Then, the two wafers (A, B) are bonded ...

Chips produced on the new wafers will also be made with the more advanced 0.13-micron manufacturing process and contain copper wires. Intel currently makes its chips with the 0.18-micron ...

[Jason] used epoxy to glue the wafer down before grabbing his iron. It took 90 minutes to solder the nine connections, but his second attempt cut that process down to just 20.