October 20, 2020 -- T2M IP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the availability of a comprehensive range of Silicon Proven SERDES Phy IPs in ...

Bengaluru (India) – Sept 14th, 2015 - SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today the release of its USB 3.1 Gen 2 SERDES IP Core.

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm ...

Check out more coverage of DesignCon 2023. As the world deals with a deluge of data, everyone is trying to move it all faster from Point A to Point B—between chips on a circuit board, over backplanes, ...

LAUSANNE, Switzerland, Jan. 28, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy efficient, chip link solutions, will demonstrate its ultra-short reach (USR) SerDes ...

Everything you need to develop and verify your high-speed digital algorithms is contained in these ultra-portable test instruments. They will forever change the way you think about developing and ...

As with any complex technology, embedded systems developers have many factors to consider when selecting a design partner in today's semiconductor market, particularly if planning to convert FPGAs to ...

HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, and Faraday Technology Corporation (TWSE: 3035), a ...

The XSR 56G and 112G Interoperability Agreements (IAs) announced by the OIF are intended to cover a channel consisting of a pair of up to 50mm. The primary defined application of the XSR SerDes is ...

Today, links such as PCI Express, HDMI, and USB are ubiquitous. But it wasn’t that way 20 years ago. The last 20 years have seen an explosion in the number of serial-link applications. This article ...