Morning Overview on MSN
TSMC’s new glass-based packaging could make the next wave of AI chips cheaper to build
Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The ...
The new manufacturing method deals with the packaging substrate, the material to which chip dies are bonded. Intel and others have long used plastic (also known as organic) substrates, but the ...
NEW YORK--(BUSINESS WIRE)--Substrate Labs, an AI infrastructure startup founded by a team from Stripe, Pulumi, and Robust Intelligence, announced an $8M seed round to deliver elegant APIs that enable ...
The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...
Foxconn has secured a major order of chip substrates for Nvidia’s HGX AI servers, supplying over 50% of Nvidia’s total demand, according to an August 14 report by Chinese tech news site IT Home.
Intel says that using glass substrates for chips instead of organic materials should allow for even more transistors to be packed into the same space, but we will have to wait a while for these chips.
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