SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will ...

Solvay, a global market leader in specialty materials, has expanded its range of FusePly® chemical bonding technology with a second product, FusePly ® 250, designed to bond composite structures at ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes to increase ...

AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...

- Aiming for mass production in FY2026 for real-world implementation in the fields of 6G communications and non-destructive sensing- Terahertz waves are electromagnetic waves in the range between ...

Kraken Bond, a manufacturer of professional-grade adhesives and construction chemicals, today highlighted the growing adoption of instant bonding technology in construction and repair applications, as ...